By Yan Li, Deepak Goyal

This quantity offers a entire reference for graduate scholars and pros in either academia and at the basics, processing information, and functions of 3D microelectronic packaging, an pattern for destiny microelectronic programs. Chapters written by way of specialists disguise the latest learn effects and growth within the following components: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complicated fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic programs. a variety of photographs, tables, and didactic schematics are integrated all through. This crucial quantity equips readers with an in-depth knowing of all facets of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture comparable reliability issues, universal mess ups, constructing parts, and destiny demanding situations, delivering insights into key components for destiny study and improvement.

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2 A few examples of blind holes drilled by laser: (a) scanning electron micrograph of the top and the profile view of a blind hole in Si having a diameter of $ 8 μm [24], and (b) a regular array of holes in Si of $ 10 μm diameter and $ 70 μm depth [22]. Note the tapered nature of drilled holes 52 P. Kumar et al. this process has been successfully employed to drill blind holes of HAR and having diameters in range of 10–80 μm in Si [25]. As multiple laser beams can be simultaneously used, this process can be used to simultaneously drill multiple holes (see Fig.

Mekonnen, I. Salama, S. Sharan, D. Iyengar, D. Mallik, Embedded multi-die interconnect bridge (EMIB)—a high density, high bandwidth packaging interconnect. Paper presented at the 66th electronic components and technology conference, Las Vegas, NV, pp. 557–565, June 2016 10. com/show/9390/the-amd-radeon-r9-fury-x-review 11. D. Meindl, Interconnect opportunities for gigascale integration, in IEEE Micro 2003, pp. 28–35 12. D. Meindl, Beyond Moore’s law: The interconnect era, in Computing in Science and Engineer, 2003 IEEE, 2003, pp.

Erdogan, A. M. P. F. McDonald, Predicting the performance of a 3D processor-memory chip stack. IEEE Des. Test Comput. 22, 540–547 (2005) 30. P. Franzon, E. Rotenberg, J. R. Davis, H. Zhou, J. Schabel, Z. B. Dwiel, E. Forbes, J. Huh, S. Lipa, Computing in 3D. Presented at the 2015 custom integrated circuits conference (CICC), 2015 IEEE, pp. 1–6, 28–30 Sept. 2015 31. K. Chandrashekar, W. Weis, B. Akesson, N. When, K. Goossens, System and circuit level power modeling of energy-efficient 3D-stacked wide I/O DRAMs.

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