By John Lau, Cheng Lee, C. Premachandran, Yu Aibin
A entire advisor to 3D MEMS packaging tools and recommendations Written by means of specialists within the box, complicated MEMS Packaging serves as a important reference for these confronted with the demanding situations created through the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor provides state-of-the-art MEMS (microelectromechanical platforms) packaging recommendations, corresponding to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you choose trustworthy, artistic, high-performance, strong, and competitively priced packaging recommendations for MEMS units. The publication also will reduction in stimulating extra learn and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, procedures, production, checking out, and reliability. one of the themes explored: complicated IC and MEMS packaging tendencies MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding suggestions Actuation mechanisms and built-in micromachining Bubble swap, optical swap, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging
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Additional resources for Advanced MEMS Packaging (Electronic Engineering)
Passive devices and modules for transceiver and manufacturing method thereof,” Song, In Sang (KR), KR20020095728 (A)—2002-12-28. 134. “MEMS device for wafer level packaging and method for fabricating the same,” Jin, Jang Seok (KR), KR20020058223 (A)— 2002-07-12. 135. , III (US) (+2), US2006194361 (A1)—2006-08-31. 35 36 Chapter One 136. “Optical fiber MEMS pressure sensor packaging structure,” Li, Wang Ming (CN), CN2811965 (Y)—2006-08-30. 137. “Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device,” Wu, Liu Yufei (CN), CN1821052 (A)—2006-08-23.
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153. , Palmateer, Lauren (+1), JP2006119603 (A)—2006-05-11. 154. “Micro-electromechanical varactor with enhanced tuning range,” Chinthakindi, Anil K. (IN), Groves, Robert A. (US) (+3), TW232500 (B)—2005-05-11. 155. “System and method for display device with end-of-life phenomena,” Palmateer, Lauren (US), US2006077524 (A1)—200604-13. 156. “Package for MEMS devices,” D’Camp, Jon B. (US), Curtis, Harlan L. (US), US2006042382 (A1)—2006-03-02. 157. “Micro-fluidic interconnect,” Okandan, Murat (US), Galambos, Paul C.