By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

A entire advisor to 3D MEMS packaging tools and recommendations Written by means of specialists within the box, complicated MEMS Packaging serves as a important reference for these confronted with the demanding situations created through the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor provides state-of-the-art MEMS (microelectromechanical platforms) packaging recommendations, corresponding to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you choose trustworthy, artistic, high-performance, strong, and competitively priced packaging recommendations for MEMS units. The publication also will reduction in stimulating extra learn and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, procedures, production, checking out, and reliability. one of the themes explored: complicated IC and MEMS packaging tendencies MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding suggestions Actuation mechanisms and built-in micromachining Bubble swap, optical swap, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

Show description

Read Online or Download Advanced MEMS Packaging (Electronic Engineering) PDF

Best nanostructures books

Techniques for Corrosion Monitoring

Corrosion tracking ideas play a key function in efforts to wrestle corrosion, that may have significant monetary and security implications. this crucial ebook begins with a evaluation of corrosion basics and offers a four-part complete research of a variety of tools for corrosion tracking, together with functional purposes and case stories.

Elasticity and geometry: from hair curls to the non-linear response of shells

Within the final two decades, researchers within the box of celestial mechanics have completed fantastic leads to their attempt to appreciate the constitution and evolution of our sun method. glossy Celestial Mechanics makes use of a pretty good theoretical foundation to explain contemporary effects on sun process dynamics, and it emphasizes the dynamics of planets and of small our bodies.

Comprehensive Hard Materials

Accomplished challenging fabrics bargains with the creation, makes use of and houses of the carbides, nitrides and borides of those metals and people of titanium, in addition to instruments of ceramics, the superhard boron nitrides and diamond and comparable compounds. Articles comprise the applied sciences of powder construction (including their precursor materials), milling, granulation, hot and cold compaction, sintering, scorching isostatic urgent, hot-pressing, injection moulding, in addition to at the coating applied sciences for refractory metals, challenging metals and tough fabrics.

Dispersion Relations in Heavily-Doped Nanostructures

This publication provides the dispersion relation in seriously doped nano-structures. The fabrics thought of are III-V, II-VI, IV-VI, hole, Ge, Platinum Antimonide, under pressure, GaSb, Te, II-V, HgTe/CdTe superlattices and Bismuth Telluride semiconductors. The dispersion relation is mentioned lower than magnetic quantization and at the foundation of service strength spectra.

Additional resources for Advanced MEMS Packaging (Electronic Engineering)

Example text

Passive devices and modules for transceiver and manufacturing method thereof,” Song, In Sang (KR), KR20020095728 (A)—2002-12-28. 134. “MEMS device for wafer level packaging and method for fabricating the same,” Jin, Jang Seok (KR), KR20020058223 (A)— 2002-07-12. 135. , III (US) (+2), US2006194361 (A1)—2006-08-31. 35 36 Chapter One 136. “Optical fiber MEMS pressure sensor packaging structure,” Li, Wang Ming (CN), CN2811965 (Y)—2006-08-30. 137. “Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device,” Wu, Liu Yufei (CN), CN1821052 (A)—2006-08-23.

2005. 2005. 2005. 2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05. 2. “Method for packaging an optical MEMS device,” Khonsari, Nassim (US), Chui, Clarence (US), EP2029473 (A2)—200903-04. 3. “Patterned contact sheet to protect critical surfaces in manufacturing processes,” Ya, Michael Wang Qing (US), Zhang, Junhong (US), CN101323428 (A)—2008-12-17.

153. , Palmateer, Lauren (+1), JP2006119603 (A)—2006-05-11. 154. “Micro-electromechanical varactor with enhanced tuning range,” Chinthakindi, Anil K. (IN), Groves, Robert A. (US) (+3), TW232500 (B)—2005-05-11. 155. “System and method for display device with end-of-life phenomena,” Palmateer, Lauren (US), US2006077524 (A1)—200604-13. 156. “Package for MEMS devices,” D’Camp, Jon B. (US), Curtis, Harlan L. (US), US2006042382 (A1)—2006-03-02. 157. “Micro-fluidic interconnect,” Okandan, Murat (US), Galambos, Paul C.

Download PDF sample

Rated 4.76 of 5 – based on 35 votes